{"id":21901,"date":"2026-06-01T11:26:21","date_gmt":"2026-06-01T17:26:21","guid":{"rendered":"https:\/\/ulprospector.ul.com\/?p=21901"},"modified":"2026-07-02T14:10:57","modified_gmt":"2026-07-02T20:10:57","slug":"pe-overcoming-the-limits-of-conventional-analysis-advanced-approaches-for-semiconductor-packaging-and-energy-related-materials","status":"publish","type":"post","link":"https:\/\/ulprospector.ul.com\/21901\/pe-overcoming-the-limits-of-conventional-analysis-advanced-approaches-for-semiconductor-packaging-and-energy-related-materials\/","title":{"rendered":"WEBINAR: Overcoming the Limits of Conventional Analysis: Advanced Approaches for Semiconductor Packaging and Energy-Related Materials"},"content":{"rendered":"\n\n\t\t\t\n\t\t\t\t\t\t\tBe notified of upcoming webinars >\n\t\t\t\t\t<\/a>\n\t

Presented by Toray Research Center Inc.<\/a><\/strong><\/h3>\n

Recorded on July 01, 2026<\/strong><\/h3>\n\t\t\t\t\n\t\t\t\t\"Slide1\"\n\t\t\t\t<\/a>\n\t

As AI, high-performance computing, and electrification continue to accelerate, semiconductor and energy-related materials are being pushed to unprecedented limits. Increasing power density, device integration, and reliability demands are creating new challenges in material design, processing, and failure analysis.<\/p>\n

In advanced semiconductor packaging, materials such as underfills and encapsulants must withstand severe thermo-mechanical stress while maintaining long-term reliability. In catalytic and energy-related systems, subtle variations in coordination structure, oxidation state, and interfacial chemistry can strongly influence reaction performance and process stability.<\/p>\n

However, conventional analytical methods often struggle to distinguish between material states that appear chemically similar but behave very differently in real applications. These hidden differences can lead to curing variability, degraded catalytic activity, reduced reliability, and unexpected process outcomes.<\/p>\n

In this webinar, Toray Research Center (TRC) introduces advanced chemical analysis approaches that reveal these hidden material states from a mechanism-based perspective.<\/p>\n

The webinar features two technical sessions.<\/p>\n

The first session addresses epoxy resin analysis for semiconductor packaging materials, including underfills and encapsulants. By combining thermal analysis techniques such as DSC and FSC with chemical and compositional analyses including TOF-SIMS and MALDI-MS, TRC demonstrates comprehensive evaluation of curing kinetics, reaction products, and filler-resin interactions influencing curing behavior. The session highlights how these analyses support reliability and process optimization for AI accelerators and high-power semiconductor devices.<\/p>\n

The second session presents an innovative methodology combining nano-electrospray ionization mass spectrometry with X-ray Absorption Fine Structure (XAFS) for direct structural identification of metal-organic complexes in solution. The approach enables detailed evaluation of coordination structures and oxidation states in solution, providing valuable insights for catalytic reactions, wet chemical processing, and energy-related material development.<\/p>\n

This webinar is aimed at professionals seeking analytical methods that provide clarity, robustness, and practical relevance for advanced material development.<\/p>\n\t

Watch the Webinar Recording<\/a><\/h4>\n

Download Slides<\/a><\/h4>\n

Contact Yoshitomo \/ Ask a Question<\/a><\/h4>\n

Contact Masahiro \/ Ask a Question<\/a><\/h4>\n\n\n","protected":false},"excerpt":{"rendered":"

Be notified of upcoming webinars > Presented by Toray Research Center Inc. Recorded on July 01, 2026 As AI, high-performance computing, and electrification continue to accelerate, semiconductor and energy-related materials are being pushed to unprecedented limits. Increasing power density, device … Continued<\/a><\/p>\n","protected":false},"author":94,"featured_media":21902,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_monsterinsights_skip_tracking":false,"episode_type":"","audio_file":"","podmotor_file_id":"","podmotor_episode_id":"","cover_image":"","cover_image_id":"","duration":"","filesize":"","filesize_raw":"","date_recorded":"","explicit":"","block":"","itunes_episode_number":"","itunes_title":"","itunes_season_number":"","itunes_episode_type":"","footnotes":""},"categories":[23,22],"tags":[1044,1045,1047,1328,1329,1330,1331],"ppma_author":[1231],"class_list":["post-21901","post","type-post","status-publish","format-standard","has-post-thumbnail","category-plastics-1","category-webinars","tag-toray","tag-toray-research-center","tag-toray-research-center-inc","tag-energy","tag-resin-systems","tag-methodology","tag-metal-organic","entry"],"yoast_head":"\nAdvanced Approaches for 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